SI CHINA     SI JAPAN
Login  |  Register          Free Newsletter Subscription
Subscribe
Email
Print
Reprint
Learn RSS

Diamond Junction Produces UV Light

Brian Dance, Contributing Editor -- Semiconductor International, 10/1/2001

Diamond has an extremely wide energy bandgap of 5.46 eV, so a diamond LED or even a laser should produce UV light at room temperature. However, diamond is normally a p-type material, and it has proved very difficult to make n-type diamond.

Satoshi Koizumi of the Japanese National Institute for Materials Science (Tsukuba, Japan) has grown both n- and p-type layers on a thin film of diamond to produce a p-n junction. Electron mobility in the p-type material is about 300 cm2/Vsec, some 5× greater than the electron mobility in the n-type material.

When a forward voltage of 20 V was applied, UV radiation was emitted from the junction with a wavelength of about 235 nm. It was accompanied by longer-wavelength visible light. It may be possible to prevent the latter by improving the quality of the boron-doped p-type region.

Email
Print
Reprint
Learn RSS

Talkback

We would love your feedback!

Post a comment

» VIEW ALL TALKBACK THREADS

Related Content

Related Content

 

By This Author

SPONSORED LINKS



 
Advertisement
SPONSORED LINKS

More Content

  • Blogs
  • Podcasts
  • Videos

Blogs

  • David Lammers
    Views on News

    November 7, 2008
    Big Wafers, Big Prices
    Dean Freeman, the Gartner semiconductor equipment analyst, threw out a zinger when he came to Austin...
    More
  • David Lammers
    Views on News

    October 31, 2008
    Three Innovations to Watch
    Innovation is the fourth great economic input, along with labor, capital, and machines, and the hard...
    More
  • » VIEW ALL BLOGS RSS

Podcasts

Videos

Advertisements





NEWSLETTERS
Plug in and get the latest SI news, trends and industry updates delivered free, directly to your inbox!

SI NewsBreak and Special Reports (Weekdays)
Wafer Processing Report (Monthly)
Lithography Report (Monthly)
Metrology Report (Monthly)
Clean Processing Report (Monthly)
Packaging Report (Twice Monthly)
©2009 Reed Business Information, a division of Reed Elsevier Inc. All rights reserved.
Use of this Web site is subject to its Terms of Use | Privacy Policy
Please visit these other Reed Business sites