ITC 2001 Considers 'Tackling Test Trade-offs'

The International Test Conference (ITC) will roll out its 32nd technical program, focusing on test-oriented technical activities, during ITC Test Week Oct. 28 to Nov. 2 at the Baltimore Convention Center. Sponsored by the IEEE's Computer Society, ITC combines a practical technical paper program with the opportunity to see the latest test products.

Again, test and design professionals will find a comprehensive program of papers, panels, lectures, exhibits, tutorials and workshops to support this year's theme, "Tackling Test Trade-offs." The conference is dedicated to electronic test technology, covering the complete cycle from design verification, test, diagnosis and failure analysis to process and design improvement. This is reflected by the technical program, which features 40 sessions covering all aspects of chip, board and systems test — including expansion into the rf test arena and new DFT architectures.

The week is scheduled to open with 16 tutorials covering diverse subjects such as boundary-scan, mixed-signal DFT, DFT for system-on-a-chip (SoC) and test challenges for low-voltage CMOS. After the tutorials, two special panels — one on the economics of SoC testing, and another contrasting the historical issues involving structured test with those of today — will take place.

The conference will formally open with its plenary session and a keynote address by Sue Billat, managing director of Robertson Stephens, entitled "Test Trade-offs: The View from Wall Street." She will discuss the larger financial trade-offs that affect the test community in the ATE sector, semiconductor manufacturing and the electronics industry as a whole. Phil Nigh of IBM Microelectronics also will address the challenges of using "cheap" DFT testers while simultaneously improving product quality.

The ITC Conference, featuring 40 sessions covering all aspects of chip, board and systems test, will be held Oct. 28-Nov. 2 at the Baltimore Convention Center. (Source: Baltimore Area Convention and Visitors Association)

Panels will explore issues challenging the test practitioner. This year's topics are: "Searching for Common Ground Between Low-Cost and High-Power ATE"; "Open MIC — Wanted: New Test Directions and Practical Test Bottlenecks"; "Can Anyone Still Afford System Test?"; "The Challenges of Managing Test"; and "Is Strip Testing the Next Advance for Semiconductor Test?"

The conference will close with workshops on test resource partitioning, yield optimization and test, and test of wireless circuits and systems.

As in years past, there will be an exhibit floor with products from the major suppliers in the test industry featuring the most recent equipment, software, services and tools for test problem resolution. Conference organizers have reduced the overlap of technical programs and exhibits to accommodate those wishing to attend both.

More than 125 companies working on test and design hardware, software, services and related materials are expected to participate.

For more information, visit www.itctestweek.org.