Siemens, Motorola to Develop 300 mm Technology in Dresden
Staff -- Semiconductor International, 2/1/1998
Semiconductor International February 1998
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Siemens, Motorola to Develop 300 mm Technology in Dresden
Siemens AG (Munich and Berlin) and Motorola Inc. (Schaumburg, Ill.) announced a joint venture agreement to develop next-generation 300 mm wafer manufacturing technology in Dresden, Germany. The two companies expect to be among the first to achieve volume production in the new technology by the year 2000. The joint venture, named "Semiconductor 300," will be located in Dresden, utilizing facilities at Siemens Semiconductors' existing advanced chip plant. Research and development costs are expected to be more than $595 million, with additional investments to be estimated at around $268 million. The start-up of the R&D project is supported by the German Federal Ministry of Education, Science, Research and Technology (BMBF) with $111 million.
Following the special guidelines for the eastern part of Germany, the State of Saxony will support the investment with ~$71 million. The project is expected to strengthen the European microelectronics industry and create ~450 new jobs in Dresden.
Siemens and Motorola earlier teamed up in a joint venture to build and operate a new manufacturing facility, White Oak Semiconductor, near Richmond, Va. The two companies are now joining forces on the 300 mm project. The two companies are also members of the Austin-based I300I consortium.
The 300 mm wafer development project will occupy a 26,000 ft2 area in Siemens Semiconductors' existing plant. The plant was completed in 1995 and features two large manufacturing modules. Currently, the facility employs 2400 people.
The plant offers the opportunity to evaluate the 300 mm manufacturing technology in comparison to an existing 200 mm production line, both based on 0.25 µm technology. The companies believe that sharing the same methodologies will provide fast and valid comparison and, therefore, accelerate learning and reduce costs. PS
Semiconductor International / February 1998
