Industry Connection
-- Semiconductor International, 6/1/2001
Semiconductor Equipment and Materials International(SEMI) is cosponsoring a survey being administered by the University of California at Berkeley on e-business among semiconductor manufacturers. The survey will attempt to assess how device manufacturers and equipment and material suppliers are using the Internet in business transactions, as well as the Internet's impact on sales, procurement, equipment maintenance, productivity, process module development and other aspects of semiconductor manufacturing. More than 600 SEMI members and 30 chip manufacturers have been asked to participate. All individual responses will be kept confidential; however, aggregate results will be made available to survey participants for use in assessing their own e-business strategies. A summary report of the findings also will be made available to the public. For further information, or to participate in this survey, visit http://groups.haas.berkeley.edu/semi-survey.ASM International has produced a new periodical, Practical Failure Analysis, which provides information and tools to assist failure analysis professionals. The publication is peer-reviewed and can benefit both experienced and new failure analysis professionals. There will be six issues published each year, topics including failure analysis/prevention techniques and failure prevention tests; cross-functional case histories; new equipment/ processes and new applications for existing equipment; education/training; lab reports; forensics; field evaluation and sampling; and reviews of classic failures. Cost of a one-year subscription is $125 for ASM members and $400 for non-members. A free review copy can be requested. For further information, visit www.asm-intl.org.
SPIE has announced that abstracts are being accepted for next year's Photonics West conference, to be held Jan. 19-25, 2002, at the San Jose Convention Center. Abstracts can be submitted in four categories: high-power lasers and applications; biomedical optics; integrated optoelectronic devices; and electronic imaging — science and technology. Abstracts can be submitted on-line, and are due June 25. For further information, visit www.spie.org/info/pw.
TheSociety of Vacuum Coaters(SVC) will sponsor three one-day short courses at SUR/FIN 2001, to be held June 26-28 at the Opryland Hotel and Convention Center (Nashville, Tenn). Courses to be offered at the conference, sponsored by the American Electroplaters and Surface Finishers Society(AESF), include Introduction to Physical Vapor Deposition Processes; Sputter Deposition in Manufacturing; and Evaporation as a Deposition Process. For further information, visit www.aesf.com or www.svc.org.
The Semiconductor Industry Association (SIA) will partner with the U.S. Environmental Protection Agency (EPA) to help reduce emissions of the perfluorocompound (PFC) greenhouse gases in the semiconductor manufacturing process. The goal of the "PFC Reduction/Climate Partnership" is to reduce annual absolute PFC emissions of participating companies by 10% below the 1995 baseline PFC emissions before the end of 2010. The SIA is signing a memorandum of understanding with the EPA on behalf of the 21 participating semiconductor manufacturers. For more information, visit www.semichips.org.
