Company News
-- Semiconductor International, 6/1/2001
Boxer Cross (Menlo Park, Calif.) shipped a BX-10 ultrashallow junction measurement system to IMEC (Leuven, Belgium). The tool will be used to help develop non-contact measurements of junction depth, amorphous film depth and implant dose for 100 nm node devices.Electro Scientific Industries (ESI, Portland, Ore.) received an order for more than $5M from Samsung (Seoul). The order includes semiconductor laser link processing tools for DRAM yield enhancement that will be used in 300 mm production. ThaiLin Semiconductor (Hsinchu, Taiwan), the largest final test house in Taiwan, also selected ESI for DRAM yield improvement on 300 mm wafers.
San Jose-based KLA-Tencor will host a Yield Management Seminar in conjunction with SEMICON West on July 17 at the Argent Hotel in San Francisco. The company will hold other YMS events in Singapore and Taiwan during August. See www.kla-tencor.com/seminar for details.
Leica Microsystems AG (Wetzlar, Germany), maker of wafer inspection, reticle inspection and e-beam lithography tools, will move the headquarters of its Semiconductor Equipment Division to Fairfax County, Va. Leica also recently joined the Advanced Reticle Center in Stuttgart, Germany, whose mission is to develop reticle technology for the 70 nm technology node.
For additional information on yield management, go to www.semiconductor.net/yield
