SEMICON West Surges Ahead
Pat Christensen Editorial Assistant -- Semiconductor International, 6/1/2001
Despite a semiconductor downturn and souring economy, with upturn predictions ranging from now to 2003, Semiconductor Equipment and Materials International (SEMI) is predicting an extremely successful 31st year for SEMICON West, the industry's largest conference and exhibition in North America.SEMICON West 2001 will be held July 16-20 and will be split between front- and back-end processes. Wafer Processing will be on display at San Francisco's Moscone Center July 16-18, and Final Manufacturing will appear at the San Jose Convention Center July 18-20. Exhibition halls will be open 10 a.m.-6 p.m. daily except on the last day of each segment (July 18 in San Francisco and July 20 in San Jose), when exhibits will close at 4 p.m.
Last year's show saw 60 separate programs over the course of the event, with 1784 exhibiting companies and 65,358 registered attendees. SEMI reports an expected 1800 exhibiting companies and 70,000 attendees this year. There is almost 380,000 ft2 of exhibiting space available to welcome those exhibitors and attendees.
This year's schedule includes a number of business and technical programs (see Tables) and more than 130 standards meetings, along with other special events. In addition to the convention centers, several of these events will take place at the San Francisco Marriott Hotel and the San Jose Fairmont Hotel.
Early birds can find several programs beginning as early as July 12. The business and technical programs include introductory fare, such as "Semiconductor Processing Technology." Aimed at non-technical sales and marketing people, finance people, personnel directors, managers and "others who do not have extensive formal training in semiconductor technology," the course will familiarize participants with the wafer fab. It will be taught July 12-14 by Peter Gwozdz of San Jose State University and Richard Blanchard of Failure Analysis Associates.
More technical presentations will include such fare as "Innovations in Semiconductor Manufacturing," a three-day event including 11 separate courses. Examples include "EHS Part 1 - Treatment Technologies for Emerging Semiconductor Processes," dealing with waste and emissions; and "Innovations in Substrate Technology," discussing challenges for Si, SiGe, SOI and GaAs substrates. The series includes a keynote address by Henry S. Becker of Infineon Technologies Richmond titled "The Challenge of Technology Leadership."
SEMICON West also features special events including the opening ceremony, to be held July 16, 9:30 a.m., at the Moscone Center. The SEMICON West International Reception will be that evening, 6-7:30 p.m., at the Palace Hotel in San Francisco. Tickets to the cocktail reception cost $75.
The Standards Members Recognition Awards Reception will be held July 17, 6:30-8:30 p.m., at the San Francisco Marriott. Awards will be presented for merit, leadership, honor, corporate device member and technical editor's appreciation, along with the Karel Urbanek Memorial Award, given for international achievement in the Standards program.
With so much to see and do, attendees will need to plan their schedules carefully. SEMI has done away with the virtual booths on its Web site this year, but exhibitor lists and program schedules will enable visitors to plan ahead. Check out www.semi.org.
Additionally, Semiconductor International's special mid-June show extra will feature expanded preview coverage of the event, including maps, exhibitor lists, product previews and other important SEMICON West information, as well as key trends to look for in the coming year written by experts in the industry. In our July issue, look for an overview of key technical trends from our editors.
Get more information about the host cities from the San Francisco Convention and Visitors Bureau and the San Jose Convention and Visitors Bureau.
| San Francisco Programs | ||
| The following will be held as indicated at the Moscone Center (MC) and the San Francisco Marriott Hotel (MH). | ||
| July 12 | ||
| 8 a.m.-5 p.m. | Semiconductor Processing Technology (day 1/3) | MC |
| July 13 | ||
| 8 a.m.-5 p.m. | Semiconductor Processing Technology (day 2/3) | MC |
| 8 a.m.-5 p.m. | How to Successfully Manage New Product Introductions (day1/2) | MC |
| July 14 | ||
| 8 a.m.-5 p.m. | Semiconductor Processing Technology (day 3/3) | MC |
| 8 a.m.-5 p.m. | How to Successfully Manage New Product Introductions (day 2/2) | MC |
| July 15 | ||
| 8 a.m.-5 p.m. | XML Workshop | MH |
| 1 p.m.-5 p.m. | STEP: Recipe Management | MH |
| July 16 | ||
| 8 a.m.-11 a.m. | EHS, Part 1: Treatment Technologies for Emerging Processes | MH |
| 8 a.m.-11 a.m. | Innovations in Interconnect Technology | MH |
| 8 a.m.-Noon | STEP: Assessment and Control of ESD and ESA | MH |
| 11:15 a.m.-Noon | Keynote: The Challenge of Technology Leadership | MH |
| 1 p.m.-4 p.m. | Stainless Steel and Surface Analysis Workshop | MH |
| 1:30 p.m.-5:30 p.m. | EHS, Part 2: EHS Challenges and Analytical Methodologies | MH |
| 2 p.m.-5 p.m. | Innovations in Substrate Technology | MH |
| July 17 | ||
| 8 a.m.-11 a.m. | CFM, Part 1: Gases, Fluid Delivery and Aluminum-Copper Protocol | MH |
| 8 a.m.-11 a.m. | CMP, Part 1: Suppliers' Perspective on Challenges and Opportunities | MH |
| 8 a.m.-Noon | Wafer Edge Zone Workshop | MH |
| 8:30 a.m.-Noon | Equipment and Materials Market Briefing | MC |
| 9 a.m.-5 p.m. | Understanding and Using Cost of Ownership | MC |
| 10 a.m.-12:30 p.m. | SEMI Chemical and Gas Manufacturing Group Meeting | MH |
| 11 a.m.-1 p.m. | Purifier Workshop | MH |
| 1 p.m.-5 p.m. | Flat-Panel Display (FDP) Seminar | MC |
| 1 p.m.-5 p.m. | Forecasting Techniques for the SEM Industry | MC |
| 1:30 p.m.-4 p.m. | Determination of Low Levels of O2 in Specialty Gases | MH |
| 2 p.m.-5 p.m. | CFM, Part 2: Liquid Chemicals and Wafer Surfaces | MH |
| 2 p.m.-5 p.m. | CMP, Part 2: CMP Technology for ULSI Manufacturing | MH |
| 3 p.m.-5 p.m. | Developing a Highly Skilled Workforce in Your Company | MC |
| 3 p.m.-6 p.m. | EHS Interest Group Meeting | MH |
| July 18 | ||
| 8 a.m.-11 a.m. | Gas Delivery and Analysis | MH |
| 8 a.m.-11 a.m. | New and Emerging Developments in Plasma Etching and CVD | MH |
| 8:30 a.m.-5:45 p.m. | 2001 ITRS Conference | MH |
| 1 p.m.-5 p.m. | STEP: Next-Generation Reticle Handling and Related Standards | MH |
| July 19 | ||
| 8 a.m.-Noon | STEP: Measurement and Management of Equipment Reliability, Availability and Maintainability (RAM) and Equipment Productivity | MH |
| 9 a.m.-Noon | E-Diagnostics Seminar | MH |
| 1 p.m.-4:30 p.m. | Standards Workshop: Development of Metrics for the Measurement and Management of Fab Level Productivity | MH |
| July 20 | ||
| 9 a.m.-Noon | International Workshop for 300 mm Software Requirements for Automated Manufacturing | MH |
| 1 p.m.-4 p.m. | E -Diagnostics Workshop | MH |
| This schedule is accurate as of April 23. | ||
| San Jose Programs | ||
| The following will be held as indicated at the San Jose Fairmont Hotel (FH) or the San Jose Convention Center (CC). | ||
| July 18 | ||
| 8 a.m.-11 a.m. | IC Packaging Materials and Assembly Process Session | FH |
| 8 a.m.-5 p.m. | SEMI Technology Symposium West 2001: Innovations in Test, Assembly & Packaging (day 1/2) | FH |
| 8 a.m.-5 p.m. | Semiconductor Processing Technology (day 1/3) | FH |
| 2 p.m.-5 p.m. | Reliability of CSPs and Advanced Packages | FH |
| July 19 | ||
| 8 a.m.-11 a.m. | 10th Annual MTC - Test Strategies for Bluetooth Devices | FH |
| 8 a.m.-5 p.m. | SEMI Technology Symposium West 2001: Innovations in Test, Assembly & Packaging (day 2/2) | FH |
| 8 a.m.-5 p.m. | Semiconductor Processing Technology (day 2/3) | FH |
| 8:30 a.m.-9:30 a.m. | Equipment and Materials Market Briefing | CC |
| 8:30 a.m.-5 p.m. | Wafer-Level Packaging Workshop | FH |
| 9 a.m.-5 p.m. | Understanding and Using Cost of Ownership - Assembly and Packaging Emphasis | FH |
| 1 p.m.-5 p.m. | STEP: Analysis and Assessment for Overall Digital Timing Accuracy | CC |
| 2 p.m.-5 p.m. | New Inspection and Metrology Technology for Fine Pitched Packages | FH |
| July 20 | ||
| 8 a.m.-5 p.m. | Semiconductor Processing Technology (day 3/3) | FH |
| This schedule is accurate as of April 23. | ||
