Elpida Develops 3-D Stacked 8 Gb DRAM
Elpida Memory said it employed copper through-silicon vias in an 8 Gb DRAM that includes eight 1 Gb DDR3 DRAMs and an interface chip. The company, which may be the first to go into production with a TSV memory, said the 8 Gb DRAM has one-fourth the standby power of current packaging solutions.
Phillip Garrou, Contributing Editor -- Semiconductor International, 9/4/2009
Elpida Memory Inc. (Tokyo) said it has developed a copper through-silicon via (Cu-TSV) technology and applied it to an 8 Gb DRAM with vertical connections among eight memory die and an interface chip.
Although several of the major memory IC producers have said they plan to offer TSV-enabled memory products, Elpida appears to be the first to commit to production in late 2009 or early 2010. "TSV is a key technology to realize Elpida's total memory solution strategy," said Elpida CTO Takao Adachi.
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Elpida said it will sample a TSV-enabled DRAM by late 2009. |
Elpida said the development "has moved the company to within sight of beginning mass production of TSV multilayer products." Sample shipments of the 8 Gb DDR3 SDRAM are scheduled to start before the end of 2009, with sampling of a 16 Gb product scheduled to begin by mid-2010. Elpida has installed a manufacturing line for volume production of TSV-based products at the company's Hiroshima fab.
The 8 Gb DDR3 SDRAM operates at 1.6 Gb/sec, and includes eight 1 Gb DDR3 SDRAM chips and an interface chip. This 8 Gb DRAM uses one-fourth the standby power of current packaging solutions, the company said.
DRAMs connected with TSVs offer extremely high bandwidth, and TSVs are expected to enable stacked memory on logic devices. Elpida said the 3-D products reduce power consumption of servers, data centers and other systems with high-density memory subsystems.
Elpida said potential TSV applications include ultrahigh-density DRAM modules for use in supercomputers and servers, stacked DRAM/logic chips for mobile systems, and high-end graphic chips for consumer electronics and game consoles.
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