Most Viewed Stories for Week of May 18, 2009
David Lammers, News Editor -- Semiconductor International, 5/22/2009
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Readers paid close attention to an overview story on flip-chip packaging, and to an account of the keynote speeches from a metrology conference held in Albany, N.Y. Axcelis announced downsizing plans, while Samsung said it would spend ~$2B on chip-related R&D. A story about GlobalFoundries working with memory startup T-RAM rounded out an eclectic week.
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Flip-Chip Packaging Becomes Competitive
Sally Cole Johnson, Contributing Editor — Semiconductor International, 5/1/2009
The cost and performance benefits of flip-chip packaging, combined with the increased cost of gold bonding wire, have made flip-chip technology competitive for applications ranging from cell phones to gaming chips.
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Metrologists: Measure Twice, Process Once
Alexander E. Braun, Senior Editor — Semiconductor International, 5/14/2009
IBM’s T.C. Chen, Alain Diebold of CNSE, and J. Alexander Liddle of NIST were among the metrology experts who spoke at the 2009 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics earlier this month. The speakers warned of problems looming on the near horizon as more exotic materials are introduced to the semiconductor industry.
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Axcelis Announces 20% Workforce Reduction
GlobeNewswire, 5/20/2009
Axcelis Technologies announced a global workforce reduction of ~235, or 20% of its employees, since year-end 2008. “This is a difficult, but necessary decision due to the continued weakness in the semiconductor industry,” said Mary Puma, chairman and CEO of Axcelis.
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Samsung Plans $2B in Semiconductor R&D
Kim Yoo-chul — Korea Times, 5/12/2009
Despite no pickup in demand, Samsung Electronics said it will spend ~$2B (~10% of chip sales) on semiconductor R&D this year to maintain its technological leadership. “Samsung will widen the technology gap with rivals by developing more-advanced DRAM and NAND flash memory chips,” said Kwon Oh-hyun, chief of Samsung’s memory business.
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GlobalFoundries and T-RAM to Tackle Advanced Nodes
Staff — Semiconductor International, 5/19/2009
T-RAM Semiconductor, which develops embedded memory IP based on thyristor technology, will work with GlobalFoundries to advance T-RAM’s embedded memory solution to the 32 and 22 nm technology generations.
Metrologists: Measure Twice, Process Once
03/17/2010Flip-Chip Packaging: Prepare for the Ramp-Up
03/17/2010We're All Doomed! (Not)
03/17/2010Flip-Chip Packaging Becomes Competitive
05/01/2009
