SMT Optical Inspection System
Staff -- Semiconductor International, 6/1/2003
VPI SMT optical inspection system can inspect BGA devices as standard, without necessitating a lengthy lens reconfiguration. It captures clear, crisp images of any SMT device or assembly feature, including wire bonds and through-holes. It can also inspect BGAs without a lens change. It can look under not only BGAs, but also any ultralow-profile package (such as CSPs and LGAs) with a standoff height as low as 0.127 mm, and as little as 0.275 mm from surrounding devices. The special tips are disposable. Its articulating lens, which rotates 90° (left/right) for easier inspection of interior rows, features an angle swing of 5° (up/down) for closer inspection of top and bottom connections. It is available with a 3-D modeling software option. Metcal, Menlo Park, Calif.
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