TSV Bonding Solution

By Semiconductor International Staff -- Semiconductor International, 9/1/2008

WaferBOND HT-10.10 is a second-generation spin-on polymer temporary wafer bonding solution. It bonds a device wafer to a temporary carrier to allow thinning and subsequent processing to create TSVs. The bonded wafer pairs have the rigidity necessary for handling during processing. Brewer Science Inc., Rolla, Mo., www.brewerscience.com

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