Applied, Disco to Develop Wafer Thinning Processes
Applied Materials Inc. and Disco Corp. will develop wafer-thinning processes for 3-D semiconductors. The effort will combine Disco's precision grinding equipment with several of Applied's capabilities.
Staff -- Semiconductor International, 3/30/2009
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Applied Materials Inc. (Santa Clara, Calif.) and Disco Corp. (Tokyo) will develop low-cost wafer-thinning processes for through-silicon vias (TSVs). The effort will combine Disco’s precision grinding equipment with Applied’s etch, dielectric deposition, physical vapor deposition (PVD) and chemical mechanical planarization (CMP) systems.
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| Applied Materials and Disco will work together on wafer-thinning processes for TSVs. |
The companies will develop wafer-thinning and post-thinning processes of wafers bonded to silicon and glass carriers, paying close attention to wafer edge integrity, handling, dimensional control, particle control, stress management and thermal profile control.
The companies will validate complete process flows at Disco’s Santa Clara research laboratory and at the Applied Maydan Technology Center, giving the partners “a unique opportunity to exploit the advantages of thinned wafers in multiple TSV integration schemes,” said Nobukazu Dejima, president of Disco Hi-Tec America Inc.
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