MEMS Tester
SEMICON West 2006-Back End Products
Staff -- Semiconductor International, 6/15/2006
TEMEON is a MEMS tester that enables stimulation of a MEMS device and accurately isolates and validates the electrical and mechanical functionality at the wafer level prior to packaging. This increases fault coverage and minimizes package waste not previously captured at the wafer level. An additional feature is low-force contact methodology at the wafer level, which eliminates any adverse effects to wafer yield caused by strain applied to MEMS structures that may alter performance and result in maximized wafer sort yields. Tokyo Electron Ltd., Tokyo, www.tel.com.
Webcast: Advances in Wafer-Level Packaging
10/01/2003Glass Serves as Wafer Level Packaging
07/31/1998Wafer Level Packaging For CSPs
07/01/1998Letter to the Editor: 3-D Interconnects
09/10/2006
























