2006 Editors' Choice Best Product Awards

The editors of Semiconductor International have chosen 20 products that represent the level of excellence required in semiconductor manufacturing.

Jennifer Yario, Associate Editor -- Semiconductor International, 7/1/2006

Many were entered, but only 20 were chosen. The coveted Editors' Choice Best Product Award, a contest hosted annually by the Semiconductor International editorial staff, was bestowed upon 19 companies with products that best reflect the level of excellence needed in our industry today.

By answering questions such as how the product has advanced state-of-the-art in wafer processing, chip assembly and packaging or device/circuit testing and how the product helps create a safer workplace, and describing the advantages and disadvantages of the product, the editors were able to narrow down the entries to focus on those deemed worthy of an award. Supplied confidential customer feedback was then added into the judging equation, and final decisions were made as to who would be awarded this honor for 2006.

The Semiconductor International staff would like to congratulate all the winners, presented here in alphabetical order by company, and we urge companies to nominate products for the 2007 awards. A sincere thank you to all the companies that participated in the 2006 contest!

And now, the envelope please...

Advantest

The T2000 open architecture system-on-a-chip (SoC) test platform is for testing complex logic, mixed-signal and most SoC devices. The series is based on the Semiconductor Test Consortium's OPENSTAR standard, which provides semiconductor makers with a degree of test flexibility previously unavailable in the industry.

The high-speed 6.5 GDM's technical capabilities facilitate device characterization and production testing, and its header-hunt feature enables data tracking even when the data itself is non- deterministic in nature. IDMs are offered a lower cost of test and evaluation, while fabless companies get a flexible platform with interchangeable modules that easily adapt to changing device requirements and an extended tester life, with a lower risk of equipment obsolescence for test houses.

Applied Materials

The UVision system is a laser 3-D brightfield inspection tool that delivers 30 nm sensitivity at production-level speeds and allows users to rapidly resolve performance-limited defect issues and achieve greater chip yields. Users are able to routinely inspect critical front- and back-end layers requiring stringent process control. It uses DUV laser illumination to detect extremely small defects, and BeamTrain multi-beam laser scanning technology for detecting yield-limiting defects at production-worthy speed. The system features include small-pixel, high-brightness laser illumination that translates to high resolution, and dual-channel imaging that is immune to color variation and pattern noise.

Applied Materials

The Producer HARP (high-aspect-ratio process) system meets the stringent requirements for the 65 nm node and below for shallow trench isolation (STI) and pre-metal dielectric (PMD) gap-fill applications. It provides void-free fill to ≤30 nm spaces and >10:1 aspect ratio STI structures. The process also enables enhanced transistor performance through strain engineering, depositing films that can induce stresses on silicon. Because HARP uses a thermal process, there is no plasma damage to the device. For PMD layers, the system has demonstrated gap-fill capability in features &10 nm.
 
 
 

Applied MicroStructures

The MVD100 (molecular vapor deposition) system was designed to accelerate the development of next-generation coatings for a wide range of nano-scale devices. The system overcomes the limitations and inherent disadvantages of the wet immersion process by eliminating the conventional chemical waste stream. During the vapor coating process, the device is loaded into the vacuum chamber. Residual contamination is removed, and the surface is prepared for cleaning. An initial layer is formed on the surface to promote adhesion. Functional coatings are then deposited in sequential steps. The MVD100 reduces particulates and surface roughness while retaining the desired physical and chemical properties of the coating.
 
 

Asymtek

Axiom X-1000 automated fluid dispensing series system was designed for inline semiconductor package and PCB assembly. The series has two components: the Axion X-1010 for SMT application of SMA, solder paste and electrically conductive adhesive applications; and the X-1020 for flip-chip and CSP underfill applications. The X-1010 uses a DispenseJet valve for non-contact jetting to deliver precise dot volume repeatability without the use of mechanical standoffs. The X-1020 Can be configured for non-contact jetting as well, and features a calibrated process jetting with contact or impingement heating to ensure a reliable thermal environment with pre-dispense, dispense and post-dispense heat stations.
 
 

ASM Technology Singapore

The Osprey transfer molding system performs the encapsulation process after wire bonding for IC, power and discrete packages, as well as BGA and map QFN packages. No product-related part conversion is required when producing different IC package types that use different leadframes/substrates and pellet sizes of epoxy molding compound. The index technology can handle leadframe lengths of up to 300 mm, the maximum width being 90 mm. All cull and runner are degated immediately after the completion of the encapsulation phase, therefore there is no additional requirement for degating. The system is designed to handle both direct gating for special packages that cannot tolerate bleed on ball pad and edge gating.
 
 

Aviza Technology

The Sigma fx P is a single-wafer cluster tool designed for high- volume PVD processing. It carries up to six process modules around a central handler, and is used for the deposition of interconnect layers in silicon and III-V-based chip fabrication. The modules for Ti/TiN or aluminum are interchangeable, so the user can switch applications in response to a loading change with just a target and shield change. Deposition process modules are based on a standard design that enables simple technology upgrades and wafer size conversion.
 
 
 

Brion Technologies

The Tachyon RDI lithography simulation and design inspection system inspects and verifies, in a matter of hours, RET/OPC designs before committing them to production. The system constructs highly accurate photomask, scanner-optics and resist-process models from manufacturing metrology data. Physical-effect resist modeling, scalar and vector models, arbitrary scanner illuminations and 128 calculation kernels in the optical modeling gives users high-quality simulation accuracy. It allows fast defect analysis and dispositioning by using comprehensive auto-classification and sophisticated pattern-matching technologies. Using the post-RET design data and image-based algorithms, Tachyon RDI simulates the exact wafer pattern contours across 100% of the entire chip area. Wafer patterning is verified and failures are identified by comparing the simulated contours with the pre-RET design target.
 

Cascade Microtech

eVue is a digital imaging system that was designed to enable productivity gains in semiconductor wafer navigation and testing. It combines wafer probe navigation tools and advanced video processing with next-generation digital microscope technology, and is optimized for on-wafer test with the company's wafer probing stations. Users are given the ability to view multiple perspectives simultaneously, which makes the navigation process efficient and productive. Additionally, it integrates optical height measurement and Z-profiling software, which enables probe touchdown accuracy for demanding over-temperature applications. The eVue digital imaging system improves wafer navigation, test setup and probe contact accuracy through the integration of microscopy, digital imaging, and software automation.

Cimetrix

The CIMPortal software product family provides a comprehensive, compliant Interface A solution for the industry. It provides users with a complete Interface A functionality, accommodates different software and hardware architectures, and establishes a fundamentally correct framework that complies with ISMI guidelines. The software allows fabs to gather critical real-time data that can be organized correctly at high speed and high quality. Special capabilities stop outside hackers from gaining entrance to fab computer networks that could potentially cause environmental or personal damage. Data collection interface modules allow equipment manufacturers to collect data from a tool with many sources, and include time stamps on all data.

Keithley

Model 4200-SCS semiconductor characterization system with pulse I-V (PIV) package enables accurate device modeling and parameter extractions in wafer-level and long-term reliability testing, failure analysis, process monitoring and diagnosis for high-k materials used in the 65 nm node and beyond. Along with ultrashort pulse testing capabilities, it allows DC device characterization with real-time plotting and analysis. The fully integrated characterization system includes a compound embedded PC with a Windows operating system and mass storage. It features a dual-channel voltage pulse generator that can produce pulses as narrow as 10 nsec, with amplitude up to ±40 V.

KLA-Tencor

The Puma 9000 Series is a family of laser-based UV inspection systems for patterned wafers for the 65 nm node and beyond. The series features Streak technology that combines multi-pixel sensor and line scanning technologies to produce high-resolution darkfield imaging. It also allows for advanced UV illumination optics with high-speed imaging, which provides a range of inspection modes optimized for critical defect detection with no compromise on throughput. The system incorporates effective pattern filtering, noise suppression capabilities, and is configurable and extendible for several technology generations.
 

Kulicke & Soffa Industries

The Maxµm ultra is a fully automatic, high-performance wire bonder created for back-end applications. It performs the wire bonding or wire interconnections between the multiple levels of an IC package. The wire bonder uses very fine gold or copper wire to physically connect the die with the package. The bonder's high-precision XYZ motion control system, complex software, and numerous subsystems provide the capability to accomplish the wire bonding process in fully automatic mode with high speed and accuracy. It also offers advanced looping capabilities to allow for flexibility in next-generation packaging applications.
 
 
 
 
 

Lam Research

The 2300 Versys Kiyo etch system was developed for critical transistor etch applications on 200 and 300 mm wafers for 90 to sub-65 nm processes. The application set for this system includes front-end processes and applications in logic, NAND and NOR flash, and DRAM. It is also being used to define the hard mask for critical front and middle of line etches, especially those using amorphous carbon. The use of engineered materials in the system allows the etching of novel materials being introduced in gate stack or capacitor structures where byproducts are often non-volatile.
 
 

MKS Instruments

The TOOLweb sensor integration platform was designed for data collection and analysis, collecting and integrating data from any source and making it available in any target. It enables the seamless integration of data from external or retrofitted sensors and instruments into the SECS/HSMS data stream of the host and tool. This permits the host to access the data from the unintegrated sensor equally with that of sensors integrated with the tool. No change is required to the tool or host software. Process faults can be detected and corrective action taken in real time, providing users with better process control and increased yield.

Novellus Systems

The Concept Two ALTUS supports 200 mm, while the Concept Three supports 300 mm wafers. Both systems are used to deposit tungsten metal films used in semiconductor devices for filling contact, via and interconnect structures by either classic CVD or advanced pulsed nucleation layer (PNL) deposition techniques. They are CMP-compatible, bevel-free, and feature void-free filling of high-aspect-ratio features >30:1. ALTUS maximized the number of wafers between cleans by providing users with a single-pressure process environment that eliminates pressure cycling and advanced flexibility by integrating low and high temperatures in the same process chamber.

Palomar Technologies

The Model 3500-II automatic component placement cell was designed for fully automatic, high-speed, high-accuracy precision microelectronics assembly. The flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip-chip operations. The machine base provides vibration damping and thermal settling response superior to granite. It is capable of performing automated eutectic die attach using backside metalized die or preforms, and enables bonding of thin die with air bridges using 2- or 4-sided perimeter collects. The placement of these die in relation to other die can be tightly controlled through custom automation algorithms. It typically yields accuracies of better than ±12 µm, 3 σ.
 

Particle Measuring Systems

The AirSentry-IMS system is a complete 193 nm contamination monitoring solution. The configuration monitors for total amines, acids, SO₂, and photochemical organic contamination (POC) in real time with sub-ppb sensitivity. It detects the molecular contamination events that cause hazing. By monitoring for optical haze formation, control engineers can proactively respond to contamination conditions and prevent costly damage. The system uses PhotoAcoustic Spectroscopy to measure the POC and Si-O contamination, and will individually quantitate methane, non-methane hydrocarbons, and silicone compounds.
 
 

Philips AMS

The IR3000 is a model-based infrared reflectance metrology solution that delivers high-throughput, non-contact, non-destructive measurements of dielectric layers and etch structures at the 130 nm node and below. It also provides users with measurements of high-aspect-ratio silicon etch structures used in the manufacture of trench DRAM and power devices. Throughput is 45 wph on five sites with pattern recognition. It allows for online measurements of trench structures at various points in the fabrication process.
 
 
 

Ricor

The MicroStar ISO-100 water vapor pump is used to increase the available vacuum pumping speed for ion implantation or any other high-vacuum and/or batch loadlock tools. It is a self-contained cryogenic pump that doesn't require a helium compressor or gas lines. The engine is Stirling-based, which means it has a thermal efficiency that allows it to deliver sufficient cooling power with power input of 100 W. The cold panel is kept at 110-140 K, so only water molecules are captured to a partial pressure as low as &10^-10 Torr.