PoP Technology
By Semiconductor International Staff -- Semiconductor International, 8/1/2008
Fan-in package-on-package (FiPoP) technology allows multiple logic, analog and memory die to be integrated in the bottom PoP and accomodates larger die sizes in a reduced footprint. It has an exposed array of land pads on the top center surface, which eliminates the requirement of the top and bottom packages to be the same size. The technology reduces package warpage and enables finer ball pitch interconnections. STATS ChipPAC Ltd., Singapore, www.statschippac.com
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PoP Technology
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