ON Semiconductor Expands With Packaging Joint Venture
SI China Staff -- Semiconductor International, 2/5/2008
ON Semiconductor Corp. (Phoenix) announced that it plans to move all packaging of small outline surface-mount (SOSM) products from Malaysia to Leshan-Phoenix Semiconductor Co. Ltd. (Sichuan, China) in 2008, increasing the Leshan facility's production capacity by 15%.
Officials said the plan will be implemented in two stages. In the first stage, equipment was transferred to Leshan-Phoenix and production was started, with production capacity expected to top one billion units. The second-stage expansion, expected to go into production in early 2009, will increase ON Semi’s SOSM capacity to two billion units per year, out of Leshan-Phoenix's annual production capacity of 23 billion units.
| Leshan-Phoenix Semiconductor Co. completed its new building in 2004. |
Leshan-Phoenix is a joint venture between ON Semiconductor, which holds a 70% stake, and Leshan Radio Co. (Leshan, Sichuan).
Through 12 years, the company's total investment tops $500M. As of the end of 2007, it had 45 production lines packaging various discrete devices, with more than 2500 employees. The facility assembles and tests miniature surface-mount transistors and diodes in a 200,000 ft2 production facility.
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