Cutting-Edge Microelectronics Manufacturing Center Gets Rolling
Sally Cole Johnson, Contributing Editor -- Semiconductor International, 4/14/2008
Binghamton University (Binghamton, N.Y.) officially opened its Center for Advanced Microelectronics Manufacturing (CAMM) at the end of March, in collaboration with Endicott Interconnect Technologies (Endicott, N.Y.) and Cornell University (Ithaca, N.Y.). The center’s primary goal is to pioneer microelectronics manufacturing R&D in a roll-to-roll (R2R) format that will result in lightweight, flexible electronic components.
The CAMM facility, which is hosted by Endicott Interconnect and draws collaborative resources from Cornell University, consists of a 10,000 ft2 area and cleanroom. It includes an integrated R2R flexible electronics prototype manufacturing line and an associated microfabrication laboratory, and is also equipped with a precision lithography stepper, vacuum coaters and an inline defect inspection system.
| A Binghamton University student examines a sheet of flexible circuitry as it comes off the R2R line. (Source: EIT) |
Most advanced electronics components are currently produced on silicon, quartz or on plates of specialized glass in a “batch” process that has long been the backbone of the IC and flat panel display (FPD) industries. Using a R2R process integrates electronics on flexible plastic, which means components can be produced more efficiently at higher yields and at a reduced cost. This may open up potential new application areas for flexible electronics.
“Endicott Interconnect is proud to serve as host to the CAMM,” said Jay McNamara, president and CEO of Endicott Interconnect. “Our working partnerships with both Binghamton University and Cornell University have resulted in a truly impressive facility that offers the opportunity to develop new technology and manufacturing capability for low-cost, high-function electronic systems on flexible substrates. This technology will be the backbone of tomorrow’s electronics.”
CAMM will begin evaluating equipment and materials developed under the auspices of the United States Display Consortium (USDC) industry, and its own research, led by Bahgat Sammakia, director of Binghamton University’s New York State Center of Excellence in Small-Scale Systems Integration & Packaging Center, and Mark Poliks, Endicott Interconnect’s director of R&D.
Interested in doing some testing of your own or using some specialized equipment? CAMM is offering large-scale testing to academic, industrial research groups and private industry, which participate in CAMM through paid memberships and funded research programs, so you can test your work for manufacturability while avoiding the high costs and risks typically associated with this sort of testing.
CAMM’s corporate members include Endicott Interconnect, General Electric, Kodak, Corning Inc., Texas Instruments, Plastic Knowledge and Samsung Electronics Co. Other partners and supporters include NASA, the Army Research Laboratory, and New York State Foundation for Science, Technology and Innovation.
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