Applied Materials Equips Siemens-Motorola's 300 mm Fab
Staff -- Semiconductor International, 4/1/1998
Semiconductor 300, the Siemens-Motorola joint venture 300 mm fab in Dresden, Germany, placed an order with Applied Materials (Santa Clara, Calif.) for a number of plasma etch, CVD, PVD and high-temperature film products, as well as wafer inspection and CD-SEM equipment. Semiconductor 300 is the world's first development line to use 300 mm wafers. Beginning in early 1999, to demonstrate the new manufacturing technology the production line will make 64Mb DRAM devices with 0.25 µm (250 nm) design rules. There are also plans to manufacture 256Mb devices at a later date. The Applied Materials 300 mm systems will begin shipping this first quarter.
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