Mapper to Ship E-Beam Lithography System to TSMC
Staff -- Semiconductor International, 10/13/2008
Mapper Lithography (Delft, Netherlands) said it will ship its first 300 mm multiple-electron-beam (e-beam) maskless lithography platform to Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC, Hsinchu, Taiwan) for 22 nm process development and device prototyping.
“Mapper’s technology holds great promise for cost-effective manufacturing at 22 nm and beyond,” said Jack Sun, vice president of R&D at TSMC. “We are therefore going to test Mapper’s solution to see whether it will live up to its promise. Using this first tool, we will be able to explore its viability for manufacturing. Mapper’s solution is a serious candidate to become the future lithography standard.”
Mapper’s eventual full-production system will use up to 13,000 parallel e-beams to directly write circuit patterns, the company said.
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| Christopher Hegarty, CEO, Mapper |
Newly installed
Mapper CEO Christopher Hegarty
said the company demonstrated its proof-of-principle in September 2007, calling the shipment to TSMC a new milestone for the company. “Having TSMC, the leading semiconductor foundry, as our launching customer for this project is a great honor for us. Their order also is a clear demonstration of TSMC’s expectation of our solution.”
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