Ulvac Intros High-Throughput Asher
At SEMICON WestUlvac introduced the Enviro Optima resist strip and residue cleaning system, which delivers 400 wph, with a modest 300 mm footprint and at the cost of $1.3M.
Laura Peters, Editor-in-Chief -- Semiconductor International, 7/16/2008
When it comes to photoresist ashing, the faster, the better. “It all comes down to throughput, footprint and cost,” said Ryoshin Imai, senior director of sales and marketing at Ulvac Methuen, Mass.). At SEMICON West, the company introduced the Enviro Optima resist strip and residue cleaning system, which delivers 400 wph, with a modest 300 mm footprint and at the cost of $1.3M. This is double the throughput of the company’s proven Enviro Optima system.
The asher addresses all critical resist stripping applications including high-dose implant, residue removal and surface preparation.
One of the ways the system achieves a higher throughput is through ultrafast robotics and a remote plasma source that enables a removal rate of >10 µm/min. Ulvac adopted Asyst’s Spartan equipment front-end module (EFEM), which has fully integrated ConX300 and EIB connectivity software. Imai claims the system is by far the lowest cost-of-ownership offering on the market.
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