Webcast: 2002-2003 IPC National Roadmap Update
By Semiconductor International Staff -- Semiconductor International, 8/21/2003
The 2002-2003 IPC National RoadmapUpdate
Focus on Backplanes and Component Packaging
Thursday, August 21, 2003
11:00 a.m. - 12:00 noon, CST
The IPC National Technology Roadmap for Electronic Interconnections was released to the public at the 2003 IPC Expo and Apex Conferences. The IPC roadmap provides a look at OEM needs in the coming decade, and how those needs translate to printed circuit board fabrication and assembly requirements. New sections added to the roadmap for 2002-2003 include Sections on Connector Technology, Backplane Technology and Roadmap Verification.
In January of this year an initial webcast provided a high level overview of the IPC Roadmap followed by discussion on sections addressing Technology Emulators, PCB Fabrication, PCB Assembly, Optoelectronics and Roadmap Verification.
On August 21, 2003 a second presentation on the IPC National Technology Roadmap will be held. This follow-up webcast, moderated by Greg Reed, will focus on Backplanes and Electronic Packaging of components. In addition an update will be provided on activities underway to make the IPC Roadmap a living document. Two major OEMs have already provided a critique to the 2002-2003 document and the roadmap committee is working to incorporate that critique. Presenters Dieter Bergman and Jack Fisher will answer questions from the online audience.
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Executive Overview of Roadmap
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Presenters
Dieter Bergman, IPC Director of Technology Transfer
Dieter Bergman joined the IPC staff in 1974 and today, serves as IPC Director of Technology Transfer, Technical Director of the IPC.
He began his career in 1950 in the Engineering Department at Philco Ford in Philadelphia where he held positions of draftsman, designer, design specialist, and in 1967 became the Supervisor of the Printed Circuit Design Group. In 1970 he joined the advanced technology group, where he specialized in printed circuit computer-aided design.
While at Philco Ford, Dieter became the company's official representative to the IPC. As a member, he received the IPC Presidents Award and served as Chairman for both the IPC Design Committee and IPC Technical Activities Executive Committee. Among his awards, in 1985 he was named to the IPC Hall of Fame, IPC's highest award.
He attended Temple University, specializing in mechanical and electronic technology.
Jack Fisher
Interconnect Technology Analysis
Jack Fisher is the principal consultant for Interconnect Technology Analysis. He is the former Chief Technical Officer of the Interconnect Technology Research Institute, which closed in 2001. Prior to joining ITRI, Mr. Fisher held several senior management and staff positions for IBM. He is a 31 year veteran of IBM's technology manufacturing and development organizations in both Endicott, New York and Austin, Texas.
Jack serves on the NEMI (National Electronics Manufacturing Initiative) Technical Committee and is Chairman of the NEMI Interconnect Substrate TWG for NEMI's roadmap. He is also a member of the SIA (Semiconductor Industry Association) Roadmap Packaging TWG.
Jack has written one book on the printed circuit industry and has authored numerous papers for trade journals and conferences. He received his education at the State University of New York at Binghamton.
IPC Description
For over 40 years, IPC - Association Connecting Electronics Industries has helped to guide the electronic interconnection industry through dramatic changes. It has been and still is the only trade association that brings together all of the players in this industry: designers, board manufacturers, assembly companies, suppliers, and original equipment manufacturers. As members of IPC, proactive participants work together to meet the challenges and ensure the future of a very important industry.
Networking is the cornerstone of IPC membership. Participants have unparalleled opportunities to network through workshops, conferences, semiannual meetings and now electronically through new services that provide on-line communications for and between members.
IPC offers a wide range of technical, management, and government relations programs to support the industry. For more information, visit www.ipc.org.
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