Inspection X-ray System
100 kV pcba|inspector
Staff -- Semiconductor International, 3/1/2001
The 100 kV pcba|inspector high-resolution microfocus X-ray system is designed for the inspection of printed circuit-board assemblies (PCBA) to detect manufacturing errors such as ball grid arrays (BGA) missing balls, voiding and shorts. It provides total-quality management for inspection and verification of boards using BGAs, flip chips, mBGAs and other high-density packages. Its X-ray source detects microscopic details as low as 4 mm. The chamber can scan boards up to 18×24 in. and can view real-time images from all angles with an optional large-capacity tilt axis up to ±45°. Optional image-processing features include automated BGA analysis, wire sweep measurement, 2-D measurement and die voiding calculation.
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