Aviza Technology Receives Orders for Deep Silicon Etch Systems
Aviza Technology Inc. announced multiple orders for its 200 mm and 300 mm Omega fxP etch systems and deep silicon (DSi) etch modules to three semiconductor manufacturers in Europe.

PTO Extends Reexamination of Tessera Patent
Tessera Technologies, Inc. announced the U.S. Patent and Trademark Office (PTO) on August 21, 2008, issued a third office action in the ongoing inter partes reexamination of Tessera's U.S. Patent No. 6,465,893 (the '893 patent).

Intel's Nehalem Processor Gets Turbo Boost
Intel's "Nehalem" will contain a technology called "turbo mode" that will dynamically reroute power to improve performance, an Intel executive said Tuesday. Intel shifted to 45-nm process technologies last year, and this year it's time for the new microarchitecture, Nehalem, to be introduced.

SUNY and Sigrity Claim Patent Infringement Against Ansoft/ANSYS
Sigrity Inc . and The Research Foundation of State University of New York have filed a lawsuit against Ansoft Corp. and ANSYS, Inc. for infringement of U.S. Patent No. 5,504,423.

Sematech to Host 3-D Manufacturing Workshop
SEMATECH will host a workshop designed to explore manufacturing and reliability challenges for three-dimensional integrated circuit (3D IC) products, in conjunction with the Advanced Metallization Conference.

Cadence Delivers System-in-Package Miniaturization
Cadence Design Systems, Inc. announced its SPB 16.2 release, which focuses aggressively on addressing current and emerging chip package design challenges. This latest release delivers advanced IC package/system-in-package (SiP) miniaturization.

Ultratech Management Sees Bright Outlook
Sales growth at Ultratech, a small chip equipment maker, is running ahead of a lot of its larger peers after it lost money from 2005 to 2007.

South Korean Engineers Develop 3-D Manufacturing Process
South Korean engineers working at the state-run National Nanofab Center and venture firm BeSang Inc. have developed 3-D technology.

STATS ChipPAC Terminates Tender Offer
STATS ChipPAC Ltd. announced that two tender offers  have been terminated because the financing conditions have not been satisfied. 

ST, STATS ChipPAC and Infineon to Develop eWLB Packaging
STMicroelectronics, STATS ChipPAC, and Infineon Technologies AG announced that they have signed an agreement to jointly develop the next-generation of embedded Wafer-Level Ball Grid Array (eWLB) technology, based on Infineon's first-generation technology. The three companies will focus on using both sides of a reconstituted wafer.

Amkor Profit Rebounds from Year-Earlier Quarter
Amkor Technology, Inc. reported its financial results for the second quarter ended June 30, 2008.

Nextreme Raises $13M for High-Volume Manufacturing
Nextreme Thermal Solutions announced securing $13M in Series B financing. The funding will be used to ramp Nextreme's products into full production in 2009.

Tessera Names Hank Nothhaft as New CEO
Tessera Technologies Inc. announced that Bruce McWilliams is transitioning to a new role as chief strategy officer. Henry R. "Hank" Nothhaft, current vice chairman of the board, will become president and chief executive officer, effective immediately.

ASE Reports 2Q Revenues Up 10% YoY
Advanced Semiconductor Engineering reported unaudited net revenues up 10% year-over-year and up 4% sequentially.

Semitool Announces Bullish Quarterly Results
Semitool Inc. reported financial results for its third fiscal quarter ended June 30, 2008. Revenue increased 44% to $67.0M.

Patent Office Rejects Tessera Claims
Orrick, Herrington & Sutcliffe LLP announced today that the United States Patent and Trademark Office issued an office action confirming the rejections of all claims of Tessera's 5,852,326 patent in ex partere examination.

Rudolph Sees 3% Revenue Bump in Quarter
Rudolph Technologies Inc. said second quarter revenue was $38.4M, up 3%.

K&S to Acquire Orthodyne and Divest Wire Business
Kulicke & Soffa Industries, Inc. announced that the company has entered into definitive agreements to acquire substantially all of the assets of Orthodyne Electronics Corp., a supplier of wedge bonders, and sell the K&S wire business unit to W.C. Heraeus GmbH, a precious metals and technology group.

ASE Reports Financial Results for 2Q
Advanced Semiconductor Engineering, Inc. reported unaudited net revenues

ASAT Expects Revenue Boost for July Quarter
ASAT Holdings Limited announced financial results for the fourth quarter and fiscal 2008, ended April 30, 2008.