Tela Innovations Closes Additional Round of Financing
Tela Innovations, an early-stage technology company developing a design solution to enable continued cost-effective scaling of semiconductor manufacturing, today announced it has closed an additional round of financing, adding corporate investors Cadence Design Systems; KT Venture Group LLC, the investment partner of KLA-Tencor Corp.; and Qualcomm Inc. to its current set of investors, which includes Intel Capital. The round totaled $5.5M and will be used to bring to market Tela's unique approach of using on-grid, straight-line, one-dimensional layout structures to provide a more efficient and reliable way to design and manufacture next-generation chips.

PDF Solutions 3Q Revenues Drops 11% from Previous Quarter
PDF Solutions, Inc. announced financial results for its third fiscal quarter ended September 30, 2008. Total revenue for the third fiscal quarter of 2008 totaled $18.8M.

PDF Solutions Provides 4Q Financial Outlook
PDF Solutions, Inc. provided its financial outlook for the fourth fiscal quarter ending December 31, 2008. The net loss for the fourth fiscal quarter of 2008 is projected in a range of $6.0M to $4.2M.

PDF Solutions Acquires Fault Detection Assets From Triant Holdings
PDF Solutions announced that it has acquired fault detection technology from Triant Holdings Inc.

TSMC Adopts Mentor's Equation-Based DRC
Mentor Graphics Corporation announced that TSMC and Mentor Graphics collaborated on physical verification (PV) solutions leveraging a new feature of the Calibre nmDRC product called "Equation-Based DRC."

PDF Solutions Acquires Fault Detection Business of Triant Holdings
PDF Solutions announced that it has entered into a definitive agreement with Triant Holdings Inc. to acquire substantially all of the assets of Triant's Fault Detection & Classification business.

Magma to Develop Yield Enhancement Software for Solar Cell Fabs
 Magma Design Automation Inc. announced development of a new yield enhancement software system customized for solar fabs to improve conversion efficiency, increase yield and reduce the manufacturing costs of solar cells.

TI's James, Toshiba's Kakumu Set as ISMI Symposium Keynoters
International Sematech Manufacturing Initiative (ISMI) Manufacturing Week today confirmed its second keynote speaker, Steve James, manager of a Texas Instruments wafer fab.

Cadence Withdraws Proposal to Acquire Mentor Graphics
Cadence Design Systems Inc. announced that it has withdrawn its proposal to acquire all of the outstanding shares of Mentor Graphics Corp.

PDF Solutions Predicts Net Loss for Third Fiscal Quarter
PDF Solutions Inc. provided its financial outlook for the third fiscal quarter ending September 30, 2008.

PDF Solutions Reports 3% Quarterly Revenue Increase
PDF Solutions Inc. said revenue for the second fiscal quarter of 2008 totaled $21.1M, up 3% from $20.3M in the first fiscal quarter of 2008 and down 11% when compared with total revenue of $23.7 million for the second fiscal quarter of 2007.

Chipworks ICInside Surveyor Accelerates Reverse Engineering
Chipworks announced ICInsider Surveyor, and will be demonstrating the tool at Semicon West in San Francisco, July 15 - 17.

TSMC Unified DFM Architecture Targets 32 nm Technology
Taiwan Semiconductor Manufacturing Company Ltd. unveiled a new Unified Design For Manufacturing (UDFM) architecture that targets 32 nm process technology.

Takumi DFM Tool Optimizes Layouts, Improves Yields
Takumi Technology Corp. announced the availability of its new layout optimization tool -- Takumi Enhance-RO for automated enforcement of recommended rules and critical area optimization.

ISMI Manufacturing Week Set for October 20-23
The International Sematech Manufacturing Initiative (ISMI) will hold the annual ISMI Manufacturing Week Oct. 20-23 in Austin, Texas.

TSMC Reference Flow Supports 40 nm DFM
Taiwan Semiconductor Manufacturing Company Ltd. today introduced Reference Flow 9.0, the latest version of TSMC's design methodology.

Mentor Qualifies Calibre Model-based Flow For TSMC's Processes
Mentor Graphics Corp. announced that its SmartFill model-based planarity flow has been qualified for TSMC's 65 and 40 nm processes.

STMicroelectronics Selects Calibre DFM for Litho Variability Analysis
Mentor Graphics announced that STMicroelectronics has selected the Mentor Graphics Calibre DFM (design for manufacturing) platform  for its Litho Variability Analysis solution.

Apache Announces Sentinel-PI for Package-System Co-Design
Apache Design Solutions announced Sentinel-PI, the industry's first fully-integrated chip-package-system co-design and co-analysis solution for power integrity.

DFMSim Launches a New Class of Software Tools
DFMSimtoday launched software tools that enable manufacturers of complex integrated circuits (ICs) to accurately predict and avoid systemic errors that seriously impact manufacturing yields.