CVD Equipment Corp. Announces New Orders
CVD Equipment Corp. announced that new orders for the three month period ending June 30, 2008 were $4.9M. This represents an increase of 53% over the same period in 2007.

Novellus Ups Tungsten Deposition for Memory Megafabs
Novellus Systems today announced the introduction of Altus Max, the latest enhancement to its pulsed nucleation layer (PNL) tungsten deposition platform.

Cambridge NanoTech Ships 100th ALD System
Cambridge NanoTech announced the shipment of their 100th ALD System to the Tata Institute of Fundamental Research (TIFR) in Mumbai, India.

Lam Research Etcher Enables Double Patterning
Lam Research Corp. introduced the 2300 Versys Kiyo3x conductor etch series.

Toshiba, IBM Bonding Approach Achieves Higher Hole Mobility
Toshiba and IBM said they have used direct silicon bonding (DSB) technology to create a higher performance CMOS FET. They announced the achievement on June 19 at the VLSI Symposia 2008, in Honolulu.

Hitachi Zosen Laser System Etches ITO Films on Large Solar Panels
Hitachi Zosen Corp. has developed a prototype thin-film laser processing machine that can handle 3-meter substrates.

ASMI Spurns $800M Bid for Front-end Activities
ASM International said it's rejected an offer of up to $800M from Applied Materials and Francisco Partners for the Dutch chip equipment maker's front-end activities.

FSI's ZETA System Reduces Surface Damage
FSI International Inc. announced today that a paper jointly presented by Hynix Semiconductor Inc.; Varian Semiconductor Equipment Associates Inc.; Nanometrics Incorporated; and FSI identifies the ZETA Spray Cleaning System with ViPR technology as a key step in the integration of ultra-high dose PLAD (plasma doping) ion implantation. The paper was presented at the 17th International Conference on Ion Implantation Technology held June 8-13, 2008, in Monterey, California.

ASMI Rejects Unsolicited Offer for ALD and PECVD Activities
ASM International N.V. announced on 6 June 2008 that it had received an unsolicited indicative offer from Applied Materials, Inc. for its ALD (Atomic Layer Deposition) and PECVD (Plasma Enhanced Chemical Vapour Deposition) activities. ASMI has today responded to Applied Materials that, as such, it has no interest to sell the ALD and/or PECVD activities. These activities are an integral part of ASMI's Front-End business. These activities are also at the heart of ASMI's strategy, and the key drivers underlying ASMI's objectives to achieve significant growth in revenues and operating margins by 2009.

Toppan Offers 32 nm Photomask Manufacturing
Toppan Printing Co., Ltd. today announced that it is the first photomask maker to develop a 32 nm photomask manufacturing process and will begin volume production in June.

Tegal Receives Etch Order From SVTC Technologies
Tegal Corp. announced today that it has received an order for a Tegal 6500 HRe-plasma etch tool from SVTC Technologies.

TSMC Unified DFM Architecture Targets 32 nm Technology
Taiwan Semiconductor Manufacturing Company Ltd. unveiled a new Unified Design For Manufacturing (UDFM) architecture that targets 32 nm process technology.

Axcelis, Sumitomo, and TPG Capital Enter Confidentiality Agreement
Axcelis Technologies Inc. reported today that it, Sumitomo Heavy Industries Ltd. and TPG Capital have entered into a confidentiality agreement with respect to discussions between the parties and the confidentiality of information to be provided by Axcelis to SHI and TPG.

Amtech to Launch New Solar PECVD Product at Intersolar
Amtech Systems Inc. announced that the company's solar subsidiary, Tempress Systems, will be introducing its latest solar cell production tool at the Intersolar 2008 Technology Trade Fair in Munich, Germany June 12-14.

Ibis Technology Receives Qualified Opinion From Accounting Firm
Ibis Technology Corp. reported that the company's independent registered public accounting firm included an explanatory paragraph in their opinion on the Company's financial statement.

SAFC Hitech Launches Metalorganic Bulk Vapor Distribution System
SAFC Hitech announced the introduction of EpiVapor, a metalorganic vapor phase distribution system for compound semiconductor manufacturing.

Intel and Micron Deliver 34 nm, 32 Gb NAND Flash
Intel Corp. and Micron Technology Inc. introduced the industry's first sub-40 nm NAND memory device, unveiling a 34 nm 32 Gb multi-level cell chip.

Mentor Qualifies Calibre Model-based Flow For TSMC's Processes
Mentor Graphics Corp. announced that its SmartFill model-based planarity flow has been qualified for TSMC's 65 and 40 nm processes.

STMicroelectronics to Offer Chinese Universities Access to CMOS Processes
STMicroelectronics and CMP (Circuits Multi Projects), a leading broker in ICs, today announced that the two companies are offering Chinese universities access to STMicroelectronics' most-advanced CMOS processes for academic and research purposes.

Tegal Receives Endeavor PVD Tool Order
Tegal Corp. announced that it received an order for an Endeavor AT PVD cluster tool.