New products for semiconductor manufacturing, including semiconductor capital equipment, materials, and equipment components and subsystems.
Image Sensor Market Set to Bounce Back Staff - 04/14/2008
IC Insights Inc. said that the image sensor market will rebound this year after a down year in 2007. The market research firm said image sensors will show a 14% CAGR over the next five years to $13.2B in 2012, driven by emerging markets. More
Test/Burn-In Sockets 05/01/2008 The CSP/Micro BGA test and burn-in sockets have been expanded to be used with devices requiring pitches as low as 0.40 mm and higher. These sockets can also be used for manual testing of DSP, LGA, SRAM, DRAM and flash devices. They provide minimal signal loss for higher-bandwidth capability via a signal path of only 1.More
Turbopumps 05/01/2008 HiPace is a line of turbopumps available in speeds that range from 10 to 700 L/sec. The line features an enhanced rotor design that reduces run-up time and provides high gas throughput and compression for light gases.More
Inkjet Printhead 05/01/2008 The 256Jet-D, an inkjet printhead, features a durable, serviceable design and stainless steel construction for printing a wide variety of direct write, printable electronics.More
Mobile Particle Counter 05/01/2008 Lasair III is a mobile particle counter designed with comprehensive software and a large, easy-to-use touchscreen.More
Mask Aligner Toolset 05/01/2008 UV-NIL is an advanced nanoimprint lithography tool that enables the company's aligners to print features using resist thicknesses <100 nm to a few hundred microns with a printing resolution down to a few nanometers.More
Solar Cell Metallization Platform 05/01/2008 PVP1200 is a screen printer capable of 1200 wph throughput. A repeatability of ±12.5 μm (6σ) resolution demonstrates the advancement of current requirements for solar cell frontside and backside metallization. The handling and support are suitable for wafer thicknesses from 1 mm down to 120 μm.More
Next-Gen Wire Bonders 05/01/2008 IConn and ConnX are next-generation wire bonders. IConn features high performance, ±2.0 μm accuracy for sub-35 μm ultrafine pitch requirements, an automatic self-teaching bond integrity test system, and programmable focus optics for complex stacked die packages.More
Dan Herr is director of Nanomanufacturing Science Research at SRC. An important part of his research focuses on nanotechnology’s demands on metrology, and he discusses his work to determine where metrology technology’s gaps are, and how to fill them.
Test/Burn-In Sockets 05/01/2008 The CSP/Micro BGA test and burn-in sockets have been expanded to be used with devices requiring pitches as low as 0.40 mm and higher. These sockets can also be used for manual testing of DSP, LGA, SRAM, DRAM and flash devices. They provide minimal signal loss for higher-bandwidth capability via a signal path of only 1....
Turbopumps 05/01/2008 HiPace is a line of turbopumps available in speeds that range from 10 to 700 L/sec. The line features an enhanced rotor design that reduces run-up time and provides high gas throughput and compression for light gases....
Inkjet Printhead 05/01/2008 The 256Jet-D, an inkjet printhead, features a durable, serviceable design and stainless steel construction for printing a wide variety of direct write, printable electronics....
View All Stories
Test/Burn-In Sockets
