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GlobalFoundries, TSMC Square Off at DATE

At a panel discussion at the DATE conference last week in Dresden, Germany, representatives from GlobalFoundries and TSMC said they are working to develop closer cooperation with EDA and IP vendors. As design cycles lengthen and leakage becomes a dominant issue, tighter cooperation will be needed with IP vendors to implement core-based DFM and reduce manufacturing costs, the panelists said. More

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Driving Down the Cost of TSVs

The race to drive down the cost of through-silicon vias (TSVs) is on, with new cost targets in clear view. Industry...

Litho Cell Efficiency Enables Continuing Cost Reduction

EUV Resists Designed for Low Acid Diffusion

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D2S Redefines Mask Rules for the 22-nm and Smaller Technology Nodes
Source: www.nanowerk.com
Date: 4 hours 22 minutes 59 seconds ago.
LEDs Magazine - Luminus and Forepi announce licensing agreement

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McClean: Semi Content Heading Up to 27%
Speaking at an IMAPS meeting, IC Insights President Bill McClean said the industry is at nearly full capacity utilization. The system semiconductor content also is headed up, compared with previous decades, McClean said. IC Insights expects a 50% increase in capex spending this year.
Most Viewed Stories for Week of March 8, 2010
Our March print cover story gained the most attention this week, as News Editor Dave Lammers expands on the debate over gate-first or gate-last approach to high-k/metal gates. Other topics on readers' radar ran a diverse range, including CMOS MEMS, HB-LEDs and graphene wafers. The Top 5 rounds out with Gartner's prognosis on significant capex spending.
Penn State Synthesizes Graphene Wafer
Penn State researchers have produced 100 mm graphene wafers, crucial for the development of graphene-based high-frequency devices. The researchers are initially focusing on graphene materials to improve transistor performance in various RF applications.
FormFactor Opens Singapore Plant
FormFactor will manufacture wafer probe cards at the new site in Singapore, which will also serve as a global business center.
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Industry Research from In-Stat

Worldwide Cellular Phone Components 5-Year Forecast

In the last three years, the mobile phone has transitioned from being a 24/7...

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Technical Manufacturing Corporation

TMC designs and manufactures precision vibration isolation systems for sensitive research and manufacturing processes worldwide. The ISO 9001:2008-certified company's products are industry standards in semiconductor manufacturing, life sciences and... more

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Perspectives From the Leading Edge

Philip Garrou, Consultant
March 12, 2010
3-D IC at the IEEE ISSCC
The IEEE Int Solid State Circuits Conf (ISSCC) is one of the conferences that...
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Chipworks Inside Angle

Dick James, Senior Technology Analyst
March 8, 2010
Energy Audits by MEMS
As we slowly move towards a more energy-efficient lifestyle, one of the individual...
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EUVL Focus

Vivek Bakshi, EUV Litho Inc.
February 17, 2010
Picking the Winning NGL Technology
Predicting the next generation lithography (NGL) technology is a big business. For...
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Alain Diebold, College of Nanoscale Science and Engineering (CNSE)
February 10, 2010
ICSE-V: The Fifth International Conference on Spectroscopic Ellipsometry
Everyone at the College of Nanoscale Science and Engineering (CNSE) is excited...
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"Tighter cooperation with IP vendors" really means giving IP vendors access to...

Jim Gobes– 3/16/2010 4:56:28 PM CDT
in response to GlobalFoundries, TSMC Square Off at DATE
Reduced plating time for TSV!The TSV "XiVIA(R)" from ÅAC Microtec has a...

Peter Nilsson– 3/15/2010 10:28:39 AM CDT
in response to Driving Down the Cost of TSVs
Thats the hottest thing I've read all...

Ms. Aneicia M. Smikle– 3/11/2010 12:59:38 PM CST
in response to Penn State Synthesizes Graphene Wafer
Of course Singapore makes a lot more sense. All the major testing factories are...

John Chapman– 3/10/2010 7:36:13 PM CST
in response to FormFactor Opens Singapore Plant

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PV Group Addresses Needs for Standards, Subsidies

Bettina Weiss, senior director for photovoltaics at SEMI, gives an update on the activities of the industry organization's PV Group, and outlines some of the various economic challenges that the technology is encountering around the world during difficult economic times, as well as developments in the area of much-needed standards to enable companies engaged in this technology to work more efficiently and with a minimum of loss.

EUV Litho Still on the Defensive

At the 2010 SPIE Advanced Lithography conference, Senior Editor Alexander E. Braun interviews Ron Kool, vice president and manager of ASML's EUV Business Unit, about the state of the much-delayed EUV litho development, and ongoing efforts to extend 193 nm immersion to 16 nm and well beyond.