Top Stories

Process Control, Yield Management in HB-LED Manufacturing

With the explosive growth in high-brightness LED (HB-LED) applications including backlighting and general illumination, device manufacturers are increasing focus on improved device performance and reduced manufacturing costs. In-line inspection during device fabrication significantly increases LED performance through improved process control and allows device makers to achieve cost savings through higher yields. More

Current Issue

FEATURES

Driving Down the Cost of TSVs

The race to drive down the cost of through-silicon vias (TSVs) is on, with new cost targets in clear view. Industry...

Litho Cell Efficiency Enables Continuing Cost Reduction

EUV Resists Designed for Low Acid Diffusion

View Current Issue

FREE Subscription

News from the Web

Industrial Nanotech CEO and Saudi Arabia's Prominent Leaders to Meet in March
Source: www.azonano.com
Date: 4 hours 27 seconds ago.
Semiconductor Recovery in 2010 More Modest Than it Appears | EMAsiaMag.com
Source: www.emasiamag.com
Date: 4 hours 10 minutes 57 seconds ago.
TierLogic Launches 3D FPGAs
Source: Electronics Weekly
Date: 4 hours 49 minutes 16 seconds ago.
iLight Technologies LED fixtures illuminate Capital City State Trail Overpass
Source: www.ledinside.com
Date: 8 hours 13 minutes 2 seconds ago.
View All Stories

Gartner Sees ‘Spurt' in Capex Spending
Gartner said wafer fab equipment and packaging and assembly equipment both will see ~76% growth this year, led by memory companies making the technology transition to DDR3 DRAMs. Capex may slow down slightly later this year before picking up again going into 2011, analyst Jim Walker said.
Baolab Claims CMOS MEMS Breakthrough
Baolab Microsystems (Barcelona, Spain) claims that is has developed manufacturing techniques that allow MEMS devices to be built within a standard CMOS process flow. The technique involves etching the IMD layers within the interconnect layers, said Baolab CEO David Doyle.
Quake is Minor Disruption at TSMC, UMC
An early Thursday earthquake in southern Taiwan caused minor damage at the Tainan chip fabs operated by foundries TSMC and UMC. Both reported that the company-wide impact would be limited to ~1.5 days, as the Tainan fabs underwent safety, maintenance and equipment checks. Several major producers of large LCDs also were impacted by the trembler.
Most Viewed Stories for Week of March 1, 2010
Readers paid attention this week to TSMC R&D head Shang-yi Chiang, who explained the foundry's technology situation to customers in Japan. Embedding die into PCB laminates is a coming trend, and IBM said it has faith in the progress of optical interconnects. An upbeat EUV lithography report by Vivek Bakshi rounded up the news from SPIE, and Intel's coveted preferred supplier awards rounded out this week's Top 5.
View All Stories

Free Business Purchase Quotes

Compare prices and features for auto dialer software.
Semiconductor International has partnered with BuyerZone to bring you free price quotes on hundreds of products, including auto dialer software and document management solutions.

Inspection, Measurement & Test

View All Stories

Industry Research from In-Stat

Worldwide Cellular Phone Components 5-Year Forecast

In the last three years, the mobile phone has transitioned from being a 24/7...

Featured Company

Technical Manufacturing Corporation

TMC designs and manufactures precision vibration isolation systems for sensitive research and manufacturing processes worldwide. The ISO 9001:2008-certified company's products are industry standards in semiconductor manufacturing, life sciences and... more

Most Recent Resources

STACIS® SEM-Base™ Active Vibration Cancellation Floor Platform for...

News From Lexis Nexis

Alchimer Opens 300 mm Applications and Development Facility in Asia

Amkor Installs Packaging Litho Systems From SUSS MicroTec

Cascade Microtech Adds 1 Hz to 40 MHz Frequency Range to Probe Stations

Novellus Develops Advanced Copper Seed Technology for TSVs

Blogs
Talkback
Podcast
Video

Chipworks Inside Angle

Dick James, Senior Technology Analyst
March 8, 2010
Energy Audits by MEMS
As we slowly move towards a more energy-efficient lifestyle, one of the individual...
More

Perspectives From the Leading Edge

Philip Garrou, Consultant
March 3, 2010
IC Consolidation, Node Scaling and 3D IC
A number electronic industry experts were gathered a few weeks ago at Half Moon...
More

EUVL Focus

Vivek Bakshi, EUV Litho Inc.
February 17, 2010
Picking the Winning NGL Technology
Predicting the next generation lithography (NGL) technology is a big business. For...
More

Alain Diebold, College of Nanoscale Science and Engineering (CNSE)
February 10, 2010
ICSE-V: The Fifth International Conference on Spectroscopic Ellipsometry
Everyone at the College of Nanoscale Science and Engineering (CNSE) is excited...
More

View All Blogs

None of the pictures are...

P H– 3/9/2010 11:08:35 AM CST
in response to Deep Silicon Etching Gets Ready for 3-D ICs
It is gradually being recognized EUVL is not purely photon but secondarily...

lithographer– 3/8/2010 9:41:26 PM CST
in response to Lotus Dreams: EUVL Continues to Approach Readiness
So how is this different/better than what Carnegie Mellon's MEMS Lab has been...

John Neumann– 3/8/2010 4:07:04 PM CST
in response to Baolab Claims CMOS MEMS Breakthrough
Hey editors,This is a detector, not a switch. Optical switches are still a...

Eric Strid– 3/8/2010 3:18:43 PM CST
in response to IBM Nanophotonic Switch Promises Faster Energy-Efficient Computing

VIEW ALL TALKBACK THREADS

EUV Litho Still on the Defensive

At the 2010 SPIE Advanced Lithography conference, Senior Editor Alexander E. Braun interviews Ron Kool, vice president and manager of ASML's EUV Business Unit, about the state of the much-delayed EUV litho development, and ongoing efforts to extend 193 nm immersion to 16 nm and well beyond.

SRC Chief Urges Beyond-CMOS, PV Technology Roadmaps

Larry Sumney, president, CEO and chairman of the board of Semiconductor Research Corp., gives his views on the state of semiconductor research in the United States and worldwide, and about the necessity to establish technology roadmaps for beyond-CMOS and photovoltaic technologies.