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IMAPS Experts Debate 3-D Cost Challenges

Packaging experts at the IMAPS Device Packaging Conference discussed industry progress on the major challenges facing 3-D TSV adoption. While recent attention has been paid to interposers with TSVs, some participants said interposers may provide an interim solution at best. Matt Nowak, director of engineering and technology development at Qualcomm, said "interposers are a cost adder and actually interfere with the form factor." More

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Gate First or Gate Last: Technologists Debate High-k

Technology managers have strong opinions on the merits of the gate-first and gate-last methods of depositing high-k...

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Lithography's generation gap
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Most Viewed Stories for Week of March 15, 2010
Two stories from Dresden, Germany, about the DATE conference there and a tour of the GlobalFoundries Dresden fab complex, were popular with readers this week. Well-traveled packaging expert Phil Garrou gained attention with a story from the IMAPS conference in Phoenix and an ISSCC panel discussion in San Francisco. A March issue contributed article on annealing of nickel silicides from Applied Materials authors rounds out this week's Top 5.
Dresden Fab Transformation Underway
GlobalFoundries Fab 1 in Dresden, Germany, is undergoing several major changes, including integration of separate modules into an integrated facility. With a steep 32 nm MPU ramp underway that includes high-k/metal gate technology, the fab is also now running foundry wafers for non-AMD customers. Dresden general manager Udo Nothelfer said 250 new tools will be installed this year.
GlobalFoundries, TSMC Square Off at DATE
At a panel discussion at the DATE conference last week in Dresden, Germany, representatives from GlobalFoundries and TSMC said they are working to develop closer cooperation with EDA and IP vendors. As design cycles lengthen and leakage becomes a dominant issue, tighter cooperation will be needed with IP vendors to implement core-based DFM and reduce manufacturing costs, the panelists said.
McClean: Semi Content Heading Up to 27%
Speaking at an IMAPS meeting, IC Insights President Bill McClean said the industry is at nearly full capacity utilization. The system semiconductor content also is headed up, compared with previous decades, McClean said. IC Insights expects a 50% increase in capex spending this year.
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Industry Research from In-Stat

Worldwide Cellular Phone Components 5-Year Forecast

In the last three years, the mobile phone has transitioned from being a 24/7...

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News From Lexis Nexis

Tegal Sells Legacy Products Lines to OEM Group, to Pursue Strategic Alternatives

Unisem Expects Revenue Boost as Packaging Rebounds

N.A. Semiconductor Equipment Industry Posts February 2010 B-B of 1.22

Albany CNSE Energy Incubator Gains Support

Blogs
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Perspectives From the Leading Edge

Philip Garrou, Consultant
March 21, 2010
Major Moves by Alchimer
Alchimer’s electrografting technology has been discussed previously [...
More

Chipworks Inside Angle

Dick James, Senior Technology Analyst
March 8, 2010
Energy Audits by MEMS
As we slowly move towards a more energy-efficient lifestyle, one of the individual...
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EUVL Focus

Vivek Bakshi, EUV Litho Inc.
February 17, 2010
Picking the Winning NGL Technology
Predicting the next generation lithography (NGL) technology is a big business. For...
More

Alain Diebold, College of Nanoscale Science and Engineering (CNSE)
February 10, 2010
ICSE-V: The Fifth International Conference on Spectroscopic Ellipsometry
Everyone at the College of Nanoscale Science and Engineering (CNSE) is excited...
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I developed a vacuum process that can reduce residual moisture and other volatile...

philip c young– 3/20/2010 9:02:38 PM CDT
in response to New Approaches to Gas Delivery Offer Significant Savings
Paul, regarding your comment below about Open-Silicon being majority owned by Abu...

David Lammers– 3/19/2010 6:34:21 PM CDT
in response to Dresden Fab Transformation Underway
Interesting analysis,...

Gary Dagastine– 3/18/2010 11:46:17 AM CDT
in response to What We Can Afford to Build
Excellent point. I did ask Mr. Sherwani a question about the background of his...

David Lammers– 3/18/2010 6:42:51 AM CDT
in response to Dresden Fab Transformation Underway

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PV Group Addresses Needs for Standards, Subsidies

Bettina Weiss, senior director for photovoltaics at SEMI, gives an update on the activities of the industry organization's PV Group, and outlines some of the various economic challenges that the technology is encountering around the world during difficult economic times, as well as developments in the area of much-needed standards to enable companies engaged in this technology to work more efficiently and with a minimum of loss.

EUV Litho Still on the Defensive

At the 2010 SPIE Advanced Lithography conference, Senior Editor Alexander E. Braun interviews Ron Kool, vice president and manager of ASML's EUV Business Unit, about the state of the much-delayed EUV litho development, and ongoing efforts to extend 193 nm immersion to 16 nm and well beyond.