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Penn State Synthesizes Graphene Wafer

Penn State researchers have produced 100 mm graphene wafers, crucial for the development of graphene-based high-frequency devices. The researchers are initially focusing on graphene materials to improve transistor performance in various RF applications. More

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Driving Down the Cost of TSVs

The race to drive down the cost of through-silicon vias (TSVs) is on, with new cost targets in clear view. Industry...

Litho Cell Efficiency Enables Continuing Cost Reduction

EUV Resists Designed for Low Acid Diffusion

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News from the Web

Chip: Below-average growth in Europe
Source: www.evertiq.com
Date: 4 hours 55 minutes 7 seconds ago.
Apache’s Totem-SE Named a Finalist in EDN’S 20th Annual Innovations Awards Competition
Source: www10.EDACafe.com
Date: 03-01-2010 17:01:25 GMT
Nova Continues Transition to Direct Sales Model With Two Additional Memory Manufacturers - Zibb.com
Source: Comtex
Date: 13 hours 9 minutes 7 seconds ago.
Radiating with Taiwan’s global LED! TILS Lights up new prospects & technology
Source: www.ledinside.com
Date: 14 hours 35 minutes 1 seconds ago.
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FormFactor Opens Singapore Plant
FormFactor will manufacture wafer probe cards at the new site in Singapore, which will also serve as a global business center.
IMEC, Synopsys to Co-Develop 3-D Stacked ICs
IMEC will use Synopsys TCAD tools in a collaboration to address reliability and performance concerns in through-silicon via (TSV) technology.
Process Control, Yield Management in HB-LED Manufacturing
With the explosive growth in high-brightness LED (HB-LED) applications including backlighting and general illumination, device manufacturers are increasing focus on improved device performance and reduced manufacturing costs. In-line inspection during device fabrication significantly increases LED performance through improved process control and allows device makers to achieve cost savings through higher yields.
Gartner Sees ‘Spurt' in Capex Spending
Gartner said wafer fab equipment and packaging and assembly equipment both will see ~76% growth this year, led by memory companies making the technology transition to DDR3 DRAMs. Capex may slow down slightly later this year before picking up again going into 2011, analyst Jim Walker said.
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Inspection, Measurement & Test

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Industry Research from In-Stat

Worldwide Cellular Phone Components 5-Year Forecast

In the last three years, the mobile phone has transitioned from being a 24/7...

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Technical Manufacturing Corporation

TMC designs and manufactures precision vibration isolation systems for sensitive research and manufacturing processes worldwide. The ISO 9001:2008-certified company's products are industry standards in semiconductor manufacturing, life sciences and... more

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STACIS® SEM-Base™ Active Vibration Cancellation Floor Platform for...

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Fast-Growing Veeco Rides An LED Boom

Applied Materials Expands Manufacturing Capability in Taiwan

AMEC Closes Series D Round With $46M in Additional Financing

SEMI: 2009 Chip Equipment Sales Were $15.92B

Blogs
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Chipworks Inside Angle

Dick James, Senior Technology Analyst
March 8, 2010
Energy Audits by MEMS
As we slowly move towards a more energy-efficient lifestyle, one of the individual...
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Perspectives From the Leading Edge

Philip Garrou, Consultant
March 3, 2010
IC Consolidation, Node Scaling and 3D IC
A number electronic industry experts were gathered a few weeks ago at Half Moon...
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EUVL Focus

Vivek Bakshi, EUV Litho Inc.
February 17, 2010
Picking the Winning NGL Technology
Predicting the next generation lithography (NGL) technology is a big business. For...
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Alain Diebold, College of Nanoscale Science and Engineering (CNSE)
February 10, 2010
ICSE-V: The Fifth International Conference on Spectroscopic Ellipsometry
Everyone at the College of Nanoscale Science and Engineering (CNSE) is excited...
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Of course Singapore makes a lot more sense. All the major testing factories are...

John Chapman– 3/10/2010 7:36:13 PM CST
in response to FormFactor Opens Singapore Plant
Is FormFactor a US or an Asian company? If its home base is in California, why...

Erik Wassenich– 3/10/2010 4:10:42 PM CST
in response to FormFactor Opens Singapore Plant
None of the pictures are...

P H– 3/9/2010 11:08:35 AM CST
in response to Deep Silicon Etching Gets Ready for 3-D ICs
It is gradually being recognized EUVL is not purely photon but secondarily...

lithographer– 3/8/2010 9:41:26 PM CST
in response to Lotus Dreams: EUVL Continues to Approach Readiness

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EUV Litho Still on the Defensive

At the 2010 SPIE Advanced Lithography conference, Senior Editor Alexander E. Braun interviews Ron Kool, vice president and manager of ASML's EUV Business Unit, about the state of the much-delayed EUV litho development, and ongoing efforts to extend 193 nm immersion to 16 nm and well beyond.

SRC Chief Urges Beyond-CMOS, PV Technology Roadmaps

Larry Sumney, president, CEO and chairman of the board of Semiconductor Research Corp., gives his views on the state of semiconductor research in the United States and worldwide, and about the necessity to establish technology roadmaps for beyond-CMOS and photovoltaic technologies.