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Driving Down the Cost of TSVs

The race to drive down the cost of through-silicon vias (TSVs) is on, with new cost targets in clear view. Industry...


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  • Gartner Sees ‘Spurt' in Capex Spending

    Gartner said wafer fab equipment and packaging and assembly equipment both will see ~76% growth this year, led by memory companies making the technology transition to DDR3 DRAMs. Capex may slow down slightly later this year before picking up again going into 2011, analyst Jim Walker said.
  • Baolab Claims CMOS MEMS Breakthrough

    baolab mems TS Baolab Microsystems (Barcelona, Spain) claims that is has developed manufacturing techniques that allow MEMS devices to be built within a standard CMOS process flow. The technique involves etching the IMD layers within the interconnect layers, said Baolab CEO David Doyle.
  • Quake is Minor Disruption at TSMC, UMC

    An early Thursday earthquake in southern Taiwan caused minor damage at the Tainan chip fabs operated by foundries TSMC and UMC. Both reported that the company-wide impact would be limited to ~1.5 days, as the Tainan fabs underwent safety, maintenance and equipment checks. Several major producers of large LCDs also were impacted by the trembler.
  • Most Viewed Stories for Week of March 1, 2010

    Top 5 030510 Readers paid attention this week to TSMC R&D head Shang-yi Chiang, who explained the foundry's technology situation to customers in Japan. Embedding die into PCB laminates is a coming trend, and IBM said it has faith in the progress of optical interconnects. An upbeat EUV lithography report by Vivek Bakshi rounded up the news from SPIE, and Intel's coveted preferred supplier awards rounded out this week's Top 5.

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Dick James

Chipworks Inside Angle

Dick James, Senior Technology Analyst
March 8, 2010
Energy Audits by MEMS
As we slowly move towards a more energy-efficient lifestyle, one of the individual...
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Phil Garrou

Perspectives From the Leading Edge

Philip Garrou, Consultant
March 3, 2010
IC Consolidation, Node Scaling and 3D IC
A number electronic industry experts were gathered a few weeks ago at Half Moon...
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Vivek Bakshi

EUVL Focus

Vivek Bakshi, EUV Litho Inc.
February 17, 2010
Picking the Winning NGL Technology
Predicting the next generation lithography (NGL) technology is a big business. For...
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Alain Diebold

Line and Rule

Alain Diebold, College of Nanoscale Science and Engineering (CNSE)
February 10, 2010
ICSE-V: The Fifth International Conference on Spectroscopic Ellipsometry
Everyone at the College of Nanoscale Science and Engineering (CNSE) is excited...
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  • EUV Litho Still on the Defensive


    At the 2010 SPIE Advanced Lithography conference, Senior Editor Alexander E. Braun interviews Ron Kool, vice president and manager of ASML's EUV Business Unit, about the state of the much-delayed EUV litho development, and ongoing efforts to extend 193 nm immersion to 16 nm and well beyond. Hear It Now
  • SRC Chief Urges Beyond-CMOS, PV Technology Roadmaps


    Larry Sumney, president, CEO and chairman of the board of Semiconductor Research Corp., gives his views on the state of semiconductor research in the United States and worldwide, and about the necessity to establish technology roadmaps for beyond-CMOS and photovoltaic technologies. Hear It Now
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